![BEOL (Back End of Line: interconnect process, the second half of wafer processing) 10. Metal-1 | USJC:United Semiconductor Japan Co., Ltd. BEOL (Back End of Line: interconnect process, the second half of wafer processing) 10. Metal-1 | USJC:United Semiconductor Japan Co., Ltd.](https://www.usjpc.com/wp/wp-content/themes/test_usjpc/images/tech-intro/process/metal-1/en_fig10-3-e_tcm102-2385391.jpg)
BEOL (Back End of Line: interconnect process, the second half of wafer processing) 10. Metal-1 | USJC:United Semiconductor Japan Co., Ltd.
Silicon trenches etched in an ICP chamber with pure Cl 2 chemistry.... | Download Scientific Diagram
![PDF] Microtrenching resulting from specular reflection during chlorine etching of silicon | Semantic Scholar PDF] Microtrenching resulting from specular reflection during chlorine etching of silicon | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/531014d7cb7b40f1687f1fddc4f2d56eedc3eb79/2-Figure1-1.png)
PDF] Microtrenching resulting from specular reflection during chlorine etching of silicon | Semantic Scholar
![Wet etching of deep trenches on silicon with three-dimensional (3D) controllability | Semantic Scholar Wet etching of deep trenches on silicon with three-dimensional (3D) controllability | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/7947874525930755e3da47914fad79da05610cb5/1-Figure1-1.png)